Role Overview
Nokia features an opportunity for a Hardware Development Engineer specializing in mechanical design within the Optical Networks (NI ON) PSE Hardware & Systems Engineering department in Bangalore, Karnataka, India (Hybrid). In this technical role, you will take ownership of mechanical design, structural packaging, and thermal optimization for high-speed optical transceiver modules and next-generation pluggable form factors. Collaborating closely with optics, electronics, and thermal engineering teams, you will drive products from early architecture and mechanical prototyping through design-for-manufacturing (DFM), validation testing, and high-volume production.
Core Responsibilities
- Mechanical Packaging & Design: Design and model mechanical enclosures and packaging solutions for OSFP, OSFP-XD, QSFP-DD, and emerging pluggable optical transceiver form factors.
- High-Density & Thermal Optimization: Develop compact, thermally optimized module structures supporting 100G, 400G, 800G, and 1.6T transmission architectures.
- Engineering Calculations & Modeling: Perform detailed mechanical calculations for insertion, extraction, and latching mechanisms using Creo Parametric 3D CAD software.
- Manufacturing Process Alignment: Apply Design for Manufacturing (DFM) and Design for Assembly (DFA) principles across precision CNC machining, die casting, and sheet metal fabrication workflows.
- Standards Compliance: Verify mechanical compliance against Multi-Source Agreement (MSA) standards, environmental criteria, and customer hardware specifications.
- Hardware Qualification & RCA: Support hardware validation stages including First Article Inspection (FAI), Design Verification Testing (DVT), and Production Validation Testing (PVT), leading root-cause analyses on manufacturing defects.
Qualifications & Requirements
- Educational Background: B.E., B.Tech, or M.Tech in Mechanical Engineering or an equivalent engineering discipline.
- Professional Experience: 3+ years of mechanical design experience, with preference for background in optical transceiver modules or high-density electronic hardware systems.
- CAD & Modeling Proficiency: Advanced skills in Creo Parametric (or equivalent 3D CAD systems) for complex part and assembly modeling.
- Tolerancing & Standards: Deep working knowledge of Geometric Dimensioning and Tolerancing (GD&T) along with tolerance stack-up analysis.
- Fabrication & Materials: Practical understanding of precision manufacturing processes (sheet metal fabrication, precision machining) and engineering material selection.
- Testing & Production: Familiarity with formal validation phases (FAI, DVT, PVT) and high-volume hardware production environments.
About Nokia
Nokia is a global leader in connectivity solutions for the AI era. Powered by research and development from Nokia Bell Labs, the organization designs and deploys secure, high-capacity fixed, mobile, and optical transport network architectures that power mission-critical communications worldwide.